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KOMAL
AGENCIES
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(A
SUPER MARKET FOR THE PLATING AND METAL FINISHING
INDUSTRIES)
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PLATING
CHEMICALS (artek)
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TEKNOPLATE
EH-384 Ÿ Acid conditioner used to alter the plastic surface to obtain
true adhesion.
KEMPLATE ACTIVATOR 1442 Ÿ Tin Palladium catalyst solution to metalise
ABS surface before electroless nickel or
copper process.
KEMPLATE PA 1491 Ÿ Post activation dip to improve initial deposition of subsequent
electroless nickel deposition.
KEMPLATE
NI 504 Ÿ Stable room temp. Electroless nickel bath to deposit uniform
conductive nickel coating on ABS plastics.
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CHEMICALS
FOR PRINTED CIRCUIT BOARDS
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PCB
Pre-Treatment Chemicals
KEMPLATE CC-150Ÿ Cleaner conditioner for better bonding and hole wall coverage.
Removes Dirt, oils and smut
KEMPLATE PC- 1453 Ÿ General purpose PCB Cleaner removes oil, soils, finger prints.
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KEMPLATE
PC 1 455 Ÿ Acidic liquid cleaner to remove the photo
resist binder residues from the copper surfaces of PCB
KEMPLATE AD 1481 Ÿ Provides clean, uniformly
etched copper surface without affecting dielectric using an ammonium persulphate type material.
KEMPLATE AD 1482 Ÿ Acid cleaner at room
temperature to clean PCBs prior to pattern plating or gold plating.
KEMPLATE E 2743 Ÿ Micro etch solution based on
hydrogen peroxide and sulphuric acid.
KEMPLATE PC 1236 Ÿ 'Pre-dip' prior to Kemplate Activator 1444 solution for activation.
KEMPLATE ACTIVATOR 1444 Ÿ Metallic formation for PCBs
suited to multilayer applications.
KEMPLATE
PA- 1491 Ÿ Post Activator dip to improve initial deposition
of electroless copper.
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ELECTROLESS COPPER
KEMPLATE CU 156 Ÿ Cleaner conditioner for
better bonding & provides excellent tarnish resistance to copper and
brass for PCBs
KEMPLATE CU 1703 A/B/C Ÿ High speed warm stable, fine grained
pink electroless copper that eliminates need
for flash electroplating.
KEMPLATE CU 1406 A/B/C Ÿ Highly stable, room temp. electroless that eliminates
need for flash type printed circuit board processing. The deposit is
bright dense, pink colour and facilitates
inspection of thru-holes after plating.
KEMPLATE CU 1705 A/B/C Ÿ High speed room temp. stable, fine grained electroless
copper that eliminates need for flash electroplating.
CUPRAMAX HT PROCESS Ÿ High throw ductile bright
strike acid copper plating process for THP of PCB on single additive.
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CUPRAMAX HT 296
PROCESS Ÿ High throw ductile bright
strike acid copper plating process for through hole plating of printed
circuit boards.
TEKNOLUME ACID TIN Ÿ A bright ductile & solderable acid tin bath to provide an effective
resist metallic coating to protect the pattern area during subsequent
etching process.
TEKNOLUME TIN- LEAD PLATING Ÿ To provide effective etch resist coating to protect the pattern areas
during subsequent etching process.
PCB
DIRECT METALLIZING PROCESS (DMSE)
KEMPLATE CC 150 Ÿ Cleaner conditioner to remove
dirt, oils and smut effectively.
KEMPLATE DMS-E Ÿ This is a main process step
in the DMS-E process which oxidatively
conditions the PCBs for the subsequent catalyst step.
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